Controlling Profiles of Replacement Gates

ABSTRACT

A method includes forming a dummy gate electrode layer over a semiconductor region, forming a mask strip over the dummy gate electrode layer, and performing a first etching process using the mask strip as a first etching mask to pattern an upper portion of the dummy gate electrode layer. A remaining portion of the upper portion of the dummy gate electrode layer forms an upper part of a dummy gate electrode. The method further includes forming a protection layer on sidewalls of the upper part of the dummy gate electrode, and performing a second etching process on a lower portion of the dummy gate electrode layer to form a lower part of the dummy gate electrode, with the protection layer and the mask strip in combination used as a second etching mask. The dummy gate electrode and an underlying dummy gate dielectric are replaced with a replacement gate stack.

BACKGROUND

Technological advances in Integrated Circuit (IC) materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generations. In the course of ICevolution, functional density (for example, the number of interconnecteddevices per chip area) has generally increased while geometry sizes havedecreased. This scaling down process generally provides benefits byincreasing production efficiency and lowering associated costs.

Such scaling down has also increased the complexity of processing andmanufacturing ICs and, for these advances to be realized, similardevelopments in IC processing and manufacturing are needed. For example,Fin Field-Effect Transistors (FinFETs) have been introduced to replaceplanar transistors. The structures of FinFETs and methods of fabricatingthe FinFETs are being developed.

The formation of FinFETs typically includes forming dummy gate stacks,and replacing the dummy gate stacks with replacement gate stacks.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 6A, 6B, 7A, 7B, 8A, 8B, 9A, 9B, 10A, 10B, 11A, 11B, 11C,12A, 12B, and 12C are perspective views and/or cross-sectional views ofintermediate stages in the formation of a Fin Field-Effect Transistor(FinFET) in accordance with some embodiments.

FIG. 13 illustrates a cross-sectional view of a gate stack in accordancewith some embodiments.

FIGS. 14A, 14B, 14C, and 14D illustrate some profiles of gate stacks inaccordance with some embodiments.

FIGS. 15A, 15B, 16A, 16B, 17A, 17B, 18A, 18B, 19A, 19B, 20A, 20B, 20C,21A, 21B, and 21C are perspective views and cross-sectional views ofintermediate stages in the formation of a FinFET in accordance with someembodiments.

FIGS. 22A, 22B, 22C, and 22D illustrate some profiles of gate stacks inaccordance with some embodiments.

FIG. 23 illustrates a process flow for forming a FinFET in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

Fin Field-Effect Transistors (FinFETs) and the methods of forming thesame are provided in accordance with some embodiments of the presentdisclosure. The intermediate stages of forming the FinFETs areillustrated. Some variations of some embodiments are discussed.Throughout the various views and embodiments, like reference numbers areused to designate like elements.

FIGS. 1 through 12A, 12B, and 12C illustrate the perspective viewsand/or cross-sectional views of intermediate stages in the formation ofa FinFET in accordance with some embodiments. The steps shown in FIGS. 1through 12A, 12B, and 12C are also illustrated schematically in theprocess flow 200 shown in FIG. 23.

FIG. 1 illustrates a perspective view of substrate 20, which may be apart of a wafer. Substrate 20 may be a semiconductor substrate, such asa silicon substrate, a silicon carbon substrate, a III-V compoundsemiconductor substrate, or a substrate formed of other semiconductormaterials. Substrate 20 may be a bulk semiconductor substrate or asilicon-on-insulator substrate. Substrate 20 may be lightly doped with ap-type or an n-type impurity.

Pad oxide 22 and hard mask 24 are formed over semiconductor substrate20. In accordance with some embodiments of the present disclosure, padoxide 22 is formed of silicon oxide, which may be formed by oxidizing asurface layer of semiconductor substrate 20. Hard mask 24 may be formedof silicon nitride, silicon oxynitride, silicon carbo-nitride, or thelike.

Next, as shown in FIG. 2, hard mask 24 and pad oxide 22 are patterned toform parallel strips. The parallel strips are then used as an etchingmask to etch substrate 20, forming trenches 26 extending intosemiconductor substrate 20. The respective process is illustrated asprocess 202 in the process flow shown in FIG. 23. Accordingly,semiconductor strips 28 are formed. Trenches 26 extend intosemiconductor substrate 20, and have lengthwise directions parallel toeach other.

Next, trenches 26 are filled to form isolation regions 30, as shown inFIG. 3. Isolation regions 30 are alternatively referred to as ShallowTrench Isolation (STI) regions 30. The respective process is illustratedas process 204 in the process flow shown in FIG. 23. The formation mayinclude filling trenches 26 with a dielectric layer(s), for example,using Flowable Chemical Vapor Deposition (FCVD), and performing aChemical Mechanical Polish (CMP) to level the top surface of thedielectric material with the top surface of hard mask 24 or the topsurfaces of isolation regions 30. After the CMP, hard mask 24 and padoxide 22 (FIG. 2) are removed.

Next, referring to FIG. 4, STI regions 30 are recessed, so that the topsurfaces of the resulting STI regions 30 are lower than the top surfaceof semiconductor strips 28. The respective process is illustrated asprocess 206 in the process flow shown in FIG. 23. Throughout thedescription, the upper portions of semiconductor strips 28, which upperportions are higher than the top surfaces of STI regions 30, arereferred to as semiconductor fins 32, while the lower portions ofsemiconductor strips 28 lower than the top surfaces of STI regions 30remain to be referred to as semiconductor strips 28.

In above-illustrated examples of embodiments, the fins may be patternedby any suitable method. For example, the fins may be patterned using oneor more photolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers, or mandrels, may then be used to pattern thefins.

FIG. 5 illustrates the formation of dummy gate dielectrics 34. Therespective process is illustrated as process 208 in the process flowshown in FIG. 23. In accordance with some embodiments of the presentdisclosure, dummy gate dielectrics 34 are formed of an oxide such assilicon oxide, and hence are alternatively referred to as dummy oxides34. Dummy oxides 34 may be formed through deposition or oxidizing thesurface layers of semiconductor fins 32. Accordingly, dummy oxides 34may or may not extend on the top surfaces of STI regions 30.

FIGS. 6A and 6B illustrates the formation of dummy gate electrode layer36 and hard mask 38 over dummy gate electrode layer 36. The respectiveprocess is also illustrated as process 208 in the process flow shown inFIG. 23. FIG. 6B illustrates a cross-sectional view of the structureshown in FIG. 6A, wherein the cross-sectional view is obtained from avertical plane containing line 6B-6B in FIG. 6A. The entire dummy gateelectrode layer 36 may be formed of a homogeneous material includingsame elements with same percentages. In accordance with some embodimentsof the present disclosure, dummy gate electrode layer 36 is formed ofamorphous silicon or polysilicon. In accordance with other embodimentsof the present disclosure, dummy gate electrode layer 36 is formed ofamorphous carbon, an oxide such as silicon oxide, a nitride such assilicon nitride, or the like. The formation method may be Atomic LayerDeposition (ALD), Chemical Vapor Deposition (CVD), Plasma EnhanceChemical Vapor Deposition (PECVD), spin-coating, or the like. Aplanarization process such as a Chemical Mechanical Polish (CMP) processor a mechanical grinding process is then preformed to level the topsurface of dummy gate electrode layer 36.

Hard mask 38 is formed over dummy gate electrode layer 36, and is thenpatterned as a hard mask strip, which crosses over semiconductor fins32. It is appreciated that although one hard mask strip 38 isillustrated, there may be a plurality of hard mask strips 38 parallel toeach other, with the plurality of hard mask strips 38 over and acrossthe underlying semiconductor fins 32. Hard mask 38 may be formed ofsilicon nitride, silicon oxynitride, or the like, and may be a singlelayer or a composite layer including a plurality of layers.

Next, as shown in FIGS. 7A and 7B, a first etching process is performedto etch dummy gate electrode layer 36. The respective process isillustrated as process 210 in the process flow shown in FIG. 23. Theetching is stopped at an intermediate level between top surface 36TS andbottom surface 36BS, which are the top surface and bottom surface,respectively, of dummy gate electrode layer 36. In accordance with someembodiments of the present disclosure, the etching is stopped at a levelhigher than the top surfaces 32A of semiconductor fins 32, asillustrated in FIGS. 7A and 7B. A lower portion 36B of dummy gateelectrode layer 36 remains un-etched. In accordance with otherembodiments of the present disclosure, the etching is stopped at a levellower than (as illustrated in FIGS. 16A and 16B) or level with the topsurfaces 32A of semiconductor fins 32. The etching is performed usinghard mask 38 as an etching mask.

The etching process shown in FIGS. 7A and 7B is performed using ananisotropic etching method, and is performed using dry etching inaccordance with some embodiments. The resulting upper gate electrodeportion 36A has substantially vertical sidewalls. In accordance withsome embodiments in which dummy gate electrode layer 36 is formed ofamorphous silicon or polysilicon, the etching gas may include a mixtureof HBr, chlorine (Cl₂), and a fluorine-based gas. The fluorine-base gasmay include C₂F₆, CF₄, F₂, or the like. A carrier gases such as nitrogen(N₂) or argon may also be added into the etching gas. Plasma is turnedon, with a first bias power being applied. The first bias power may bein the range between about 200 Watts and about 400 Watts, for example.

FIG. 7B illustrates a cross-sectional view of the structure shown inFIG. 7A, wherein the cross-sectional view is obtained from the planecontaining line 7B-7B in FIG. 7A. The top surface level 32A ofsemiconductor fins 32 is illustrated. Dashed lines 33 are alsoillustrated to schematically illustrate the possible levels where thefirst etching process may be stopped.

Referring to FIGS. 8A and 8B, protection layer 40 is formed. Therespective process is illustrated as process 212 in the process flowshown in FIG. 23. The material of protection layer 40 is different fromthe material of dummy gate electrode layer 36, dummy gate dielectrics34, and STI regions 30. In accordance with some embodiments of thepresent disclosure, protection layer 40 is formed of SiN, SiON, SiCON,SiC, SiOC, SiO₂, or the like. The thickness of protection layer 40 maybe in the range between about 2 Å and about 10 Å. Protection layer 40 isformed using a conformal deposition method such as ALD or CVD.Accordingly, protection layer 40 includes sidewall portions on thesidewalls of hard mask 38 and upper dummy gate electrode portion 36A.Protection layer 40 further includes horizontal portions on the topsurface of hard mask 38 and the top surface of lower dummy gateelectrode portion 36B.

FIG. 8B illustrates a perspective view of the structure shown in FIG.8A, wherein the perspective view is obtained from the direction markedby arrow 37 shown in FIG. 8A.

Referring to FIG. 9A, an anisotropic etching process is performed onprotection layer 40, so that the horizontal portions of protection layer40 are etched, and the top surface of lower dummy gate electrode portion36B is exposed. The respective process is illustrated as process 214 inthe process flow shown in FIG. 23. Next, a second etching process isfurther performed to etch lower dummy gate electrode portion 36B. Therespective process is illustrated as process 216 in the process flowshown in FIG. 23. The remaining portions of dummy gate electrode layer36 are referred to as a dummy gate electrode, which is also referred tousing reference numeral 36 hereinafter.

The second etching process is anisotropic so that the resulting lowergate electrode portion 36B has substantially vertical sidewalls. In thesecond etch, since dummy gate dielectrics 34 and STI regions 30 areexposed, to prevent dummy gate dielectrics 34 and STI regions 30 frombeing etched, the etching gas is selected not to attack dummy gatedielectrics 34 and STI regions 30. The respective etching selectivityvalues may be higher than about 10, 20, or higher, wherein the etchingselectivity values are the ratios of the etching rate of dummy gateelectrode layer 36 to the etching rates of the dummy gate dielectrics 34and STI regions 30. Also, in the second etching, protection layer 40remains as a full layer covering the sidewalls of upper dummy gateelectrode portion 36A.

In accordance with some embodiments in which dummy gate electrode layer36 is formed of amorphous silicon or polysilicon, the etching gas of thesecond etching process may include a mixture of HBr, chlorine (Cl₂), andoxygen (O₂). The fluorine-based gas as adopted in the first etchingprocess of upper dummy gate electrode portion 36A may be excluded fromthe second etching process. Alternatively, the fluorine-based gas isalso included with a reduced amount than in the first etching. Forexample, assuming the flow rate of the fluorine-based gas in the etchingof upper dummy gate electrode portion 36A is FRU, and the flow rate ofthe fluorine-based gas in the etching of lower dummy gate electrodeportion 36B is FRL, ratio FRL/FRU may be smaller than about 0.2 orsmaller than about 0.1. A carrier gas such as nitrogen (N₂) or argon mayalso be added into the etching gas. Plasma is turned on, with a secondbias power being applied. The second bias power may be substantiallyequal to, smaller than, or greater than the first bias power for etchingupper dummy gate electrode portion 36A. In accordance with someembodiments of the present disclosure, the second bias power is in therange between about 200 Watts and about 400 Watts. In the second etchingprocess, upper dummy gate electrode portion 36A is protected byprotection layer 40, and hence is not etched.

FIG. 9B illustrates a perspective view of the structure shown in FIG.9A, wherein the perspective view is obtained from the direction markedby arrow 37 shown in FIG. 9A.

FIGS. 10A and 10B illustrate a trimming process to trim lower dummy gateelectrode portion 36B. The respective process is illustrated as process218 in the process flow shown in FIG. 23. In the trimming process, upperdummy gate electrode portion 36A is protected by protection layer 40.Lower dummy gate electrode portion 36B is trimmed, and hence isnarrowed, and possibly tapered. In accordance with some embodiments inwhich dummy gate electrode layer 36 is formed of amorphous silicon orpolysilicon, the etching gas for the trimming process may include amixture of HBr, of chlorine (Cl₂), and oxygen (O₂). Again, thefluorine-based gas as adopted in the first etching process may beexcluded from the trimming process, or the amount may be reducedcompared to the etching of upper dummy gate electrode portion 36A. Forexample, assuming the flow rate of the fluorine-based gas in thetrimming process is FRT, ratio FRT/FRU may be smaller than about 0.2 orsmaller than about 0.1. A carrier gas such as nitrogen (N₂) or argon mayalso be added into the etching gas. Plasma is turned on, with a thirdbias power being applied. The third bias power is lower than the firstbias power for etching upper dummy gate electrode portion 36A. Inaccordance with some embodiments of the present disclosure, the thirdbias power is in the range between about 50 Watts and about 150 Watts.The ratio of the third power to the first power (and the second power)may be in the range between about 0.1 and about 0.5, for example.Reducing the bias power in the trimming process has the effect ofintroducing some isotropic effect, so that lower dummy gate electrodeportion 36B is tapered rather than having footing. In accordance withsome embodiments of the present disclosure, at the end of the secondetching process, bias power is reduced to seamlessly transition to thetrimming process, and other process conditions are maintain to beunchanged.

In the trimming process, upper dummy gate electrode portion 36A isprotected by protection layer 40, and hence is not trimmed. Thesidewalls of upper dummy gate electrode portion 36A are thus morevertical than lower dummy gate electrode portion 36B. Alternativelystated, the sidewalls of lower dummy gate electrode portion 36B are moreslanted/tilted than the sidewalls of upper dummy gate electrode portion36A. The process conditions (such as the isotropic effect) are adjustedto adjust the tilt angle of the lower portion of dummy gate electrodelayer 36. For example, reducing the bias power may cause the sidewallsof lower dummy gate electrode portion 36B to be more tilted.

In accordance with some embodiments of the present disclosure, after thetrimming process, the remaining portions of protection layer 40 areremoved, for example, in a wet etch process or a dry etch process. Inaccordance with alternative embodiments of the present disclosure, afterthe trimming process, the remaining portions of protection layer 40 isnot removed, and the processes shown in FIGS. 11A, 11B, and 11C areperformed with the existence of protection layer 40.

FIG. 10B illustrates a perspective view of the structure shown in FIG.10A, wherein the perspective view is obtained from the direction markedby arrow 37 shown in FIG. 10A. The tapered sidewalls of lower dummy gateelectrode portion 36B are shown in FIG. 10B.

FIGS. 11A, 11B, and 11C illustrate a perspective view andcross-sectional views of the structure after the formation of gatespacers, source/drain (S/D) regions, a Contact Etch Stop Layer (CESL),and an Inter-Layer Dielectric (ILD). The respective process isillustrated as process 220 in the process flow shown in FIG. 23. FIG.11A illustrates a schematic view of gate spacers 42, source/drain (S/D)regions 44, CESL 46, and ILD 48, wherein the details may be found in thecross-sectional view shown in FIGS. 11B and 11C. The formation processesof these components are discussed briefly in subsequent paragraphs.

First, gate spacers 42 (refer to FIGS. 11B and 11C) are formed. Gatespacers 42 are formed on the sidewalls of dummy gate electrode 36 andhard mask 38 (FIG. 10A). In accordance with some embodiments of thepresent disclosure, gate spacers 42 are formed by conformably depositinga dielectric layer(s), and then performing an anisotropic etching toremove the horizontal portions of the dielectric layer(s), leaving thevertical portions of the dielectric layer(s). In accordance with someembodiments of the present disclosure, gate spacers 42 are formed ofsilicon nitride, and may have a single-layer structure. In accordancewith alternative embodiments of the present disclosure, gate spacers 42have a composite structure including a plurality of layers. For example,gate spacers 42 may include a silicon oxide layer, and a silicon nitridelayer over the silicon oxide layer. Dummy gate electrode 36 and gatespacers 42 in combination cover some portions of semiconductor fins 32,leaving some other portions not covered.

Source/drain region 44 (FIG. 11A) are then formed based on the exposedportions of semiconductor fins 32. In accordance with some embodimentsof the present disclosure, the formation of source/drain region 44includes implanting the exposed semiconductor fins 32 with a p-type orn-type dopant to form p-type or an n-type source/drain regions. Inaccordance with some embodiments of the present disclosure, theformation of source/drain region 44 includes etching the exposedportions of semiconductor fins 32, and re-growing epitaxy semiconductorregions from the respective recesses. Depending on whether the resultingFinFET is a p-type FinFET or an n-type FinFET, a p-type or an n-typeimpurity may be in-situ doped with the proceeding of the epitaxy. Forexample, when the resulting FinFET is a p-type FinFET, silicon germaniumboron (SiGeB), SiGe, or the like may be grown. Conversely, when theresulting FinFET is an n-type FinFET, silicon phosphorous (SiP), siliconcarbon phosphorous (SiCP), or the like may be grown. In accordance withalternative embodiments of the present disclosure, source/drain regions44 are formed of a III-V compound semiconductor such as GaAs, InP, GaN,InGaAs, InAlAs, GaSb, AlSb, AlAs, AlP, GaP, combinations thereof, ormulti-layers thereof. After epitaxy regions fully fill the recesses, theepitaxy regions start expanding horizontally, and facets may be formed.An implantation may be performed to introduce more p-type or n-typeimpurities into source/drain regions 44.

Next, CESL 46 (FIGS. 11B and 11C) is deposited conformally. ILD 48 isthen formed on CESL 46. A planarization process such as a CMP process ora mechanical grinding process is then performed to remove excessportions of ILD 48 and CESL 46. In accordance with some embodiments ofthe present disclosure, the planarization process removes hard mask 38as shown in FIG. 10A, and dummy gate electrode layer 36 is exposed, asshown in the resulting structure in FIGS. 11B and 11C. In accordancewith alternative embodiments of the present disclosure, the CMP stops onhard mask 38.

FIG. 11B illustrates the cross-sectional obtained from the verticalplane containing line 11B-11B in FIG. 11A. FIG. 11C illustrates thecross-sectional obtained from the vertical plane containing line 11C-11Cin FIG. 11A. As shown in FIGS. 11B and 11C, gate spacers 42 are on outerside of, and contacting, protection layer 40. When viewed from top,protection layer 40 may form a full ring encircling dummy hard mask 38(if remaining) and the top portion of dummy gate electrode 36. Gatespacers 42 form another full ring encircling the ring of protectionlayer 40. Line 50 in FIG. 11C represents the top surface level ofsemiconductor fins 32 (FIG. 11B). The bottom ends of protection layer 40are higher than the top surface level 50 of semiconductor fins 32 inaccordance with some embodiments.

FIGS. 12A, 12B, and 12C illustrate a perspective view andcross-sectional views of the structure after dummy gate dielectrics 34and dummy gate electrode 36 are replaced with replacement gate stack 52.The respective process is illustrated as process 222 in the process flowshown in FIG. 23. FIG. 12A illustrates a schematic view, wherein somedetails may be found in the cross-sectional view shown in FIGS. 12B and12C. FIG. 12B illustrates the cross-sectional obtained from the verticalplane containing line 12B-12B in FIG. 12A. FIG. 12C illustrates thecross-sectional obtained from the vertical plane containing line 12C-12Cin FIG. 12A.

In the replacing of gate stacks, dummy gate electrode 36 (FIGS. 11A,11B, and 11C) is first etched, resulting in a trench encircled byprotection layer 40 and gate spacer 42. In subsequent steps, the exposeddummy oxide 34 (FIG. 11B) is etched, exposing a portion of semiconductorfin 32. Protection layer 40 is also exposed through the trench.Protection layer 40, if to be removed, may be removed from the trench.Next, replacement gate stack 52, as shown in FIG. 12A, is formed in thetrench. Replacement gate stack 52 may include one or a plurality ofdielectric layers to form replacement gate dielectric 54 (FIG. 12B), anda plurality of conductive layers to form replacement gate electrode 56.In accordance with some embodiments of the present disclosure, theformation of gate dielectric 54 includes forming an interfacial(dielectric) layer, and then forming a high-k dielectric layer over theinterfacial layer. The interfacial layer may be a silicon oxide layer.The high-k dielectric layer is deposited on the interfacial layer. Inaccordance with some embodiments of the present disclosure, the high-kdielectric layer has a k value greater than about 7.0, and may include ametal oxide or a silicate of Hf, Al, Zr, La, and the like.

Replacement gate electrode 56 is formed over replacement gate dielectric54. Replacement gate electrode 56 may include a plurality ofmetal-containing layers formed of metal-containing materials such asTiN, TaN, TaC, TiAl, Co, Ru, Al, Cu, W, alloys thereof, or multi-layersthereof. After the formation of gate dielectric 54 and gate electrode56, a planarization process such as a CMP process or a mechanicalgrinding process is performed to remove excess portions of gatedielectric 54 and gate electrode 56 over ILD 48. FinFET 57 is thusformed.

As shown in FIGS. 12B and 12C, gate stack 52 has a top portion 52Ahaving substantially vertical sidewalls, and a tapered lower portion52B. In accordance with some embodiments of the present disclosure,protection layer 40 is left in FinFET 57. Also, protection layer 40 maybe formed of a same material as, or a material different from, thematerial of either one or both of gate dielectric 54 (such as high-kdielectric material) and gate spacer 42.

Referring to FIG. 12B, gate stack 52 includes sidewalls 52A′, which arealso the sidewalls of gate dielectrics 54. Each of sidewalls 52A′includes upper portion 52A1′ and lower portion 52A2′, both may besubstantially straight. Upper portion 52A1′ has a first tilt angle θ1.Upper portion 52A1′ may be vertical or substantially vertical, forexample, with tilt angle θ1 being smaller than about 2 degrees orsmaller than about 1 degree. Lower portion 52A2′ has a second tilt angleθ2. Lower portion 52A2′ is tilted with the tilt angle θ2 being greaterthan 1 degree or greater than about 3 degrees. In accordance with someembodiments of the present disclosure, tilt angle θ2 is in the rangebetween about 3 degrees and about 10 degrees. Tilt angle θ2 is greaterthan tilt angle θ1, with difference (θ2-θ1) being greater than 1 degree,and possibly greater than about 3 degrees. Tilt angle difference (θ2-θ1)may also be in the range between about 3 degrees and about 10 degrees.

Referring to FIG. 12C, gate stack 52 includes sidewalls 52A″, which arealso the sidewalls of gate dielectrics 54. Each of sidewalls 52A″includes an upper portion 52A1″ and lower portion 52A2″, both may besubstantially straight. Upper portion 52A1″ has a first tilt angle θ1′.Lower portion 52A2″ has a second tilt angle θ2′. Tilt angles θ1, θ2,θ1′, and θ2′ are all the tile angles of the sidewalls of gate stack 52,except tilt angles θ1 and 02 are viewed in the vertical planeperpendicular to the lengthwise direction of semiconductor fins 32, andtilt angles θ1′ and θ2′ are viewed in the vertical plane parallel to thelengthwise direction of semiconductor fins 32. The tilt angles θ1′ andθ2′ may be in the substantially same ranges as the corresponding tiltangles θ1 and θ2. Tilt angles θ1 and θ1′ may be equal to each other orslightly different from each other. Tilt angles θ2 and θ2′ may be equalto each other or slightly different from each other.

FIG. 12C also illustrates three dimensions W1, W2, and W3 of gate stack52 measured at different levels. Width W2 is measured at the bottom endof protection layer 40. Since the top end of gate stack 52 may berounded, top width W1 may be measured at a level where the sidewalls ofgate stack 52 are already straight. For example, top width W1 may bemeasured at the top end of protection layer 40 or at a level that is 5nm below the top end of protection layer 40. Bottom width W3 may bemeasured at the level of the bottommost point of the filling metal (suchas tungsten or cobalt) (as shown in FIG. 13), or at a level that isabout 10 nm higher than the bottommost point of gate stack 52. Widths W1and W2 may be substantially equal to each other, for example, with theabsolute value of the difference (W1−W2) being smaller than about 3 Å orsmaller than 1 Å. Widths W1 and W2 may be greater than width W3, forexample, with widths (W1−W3) and (W2−W3) may be greater than about 3 Åor greater than about 5 Å. Widths (W1−W3) and (W2−W3) may also be in therange between about 3 Å and about 10 Å.

FIG. 12C illustrates the heights H1, H2, and H3. Height H1 is the heightof protection layer 40. Height H2 is the height of the portion of gatestack directly over the top end of semiconductor fin 32, wherein level50 marks the level of the top end of fin 32. Height H3 is the height ofgate stack 52. In accordance with some embodiments of the presentdisclosure, H2 is greater than (as shown in FIG. 12C), equal to, orsmaller than (as shown in FIG. 21C) height H1. Heights H1 and H2 aresmaller than height H3. Height H1 may be in the range between about 5 Åand about 2,000 Å. Height H2 may be in the range between about 5 Å andabout 2,000 Å, and may also be in the range between about 100 Å andabout 500 Å. Height H3 may be in the range between about 5 Å and about2,000 Å, and may also be in the range between about 300 Å and about 700Å.

FIG. 13 illustrates a more detailed view of gate stack 52 and protectionlayer 40. Gate stack 52 includes gate dielectric 54, a plurality ofmetal layers 56A, and filling metal 56B over the bottom portion of metallayers 56A. Metal layers 56A may include diffusion barriers, workfunction layers, adhesion layers, or the like. Filling metal 56B may beformed of tungsten or cobalt.

FIGS. 14A, 14B, 14C, and 14D illustrate the possible schematic profilesof the sidewalls of gate stack 52. FIGS. 14A and 14B reflect thecross-sectional views corresponding to FIG. 12C. FIGS. 14C and 14Dreflect the cross-sectional views of corresponding to the left part ofFIG. 12B. In FIGS. 14A and 14C, the upper portion of gate stack 52 isstraight and vertical, and the lower portion of gate stack 52 isstraight and continuously tapers down. In FIGS. 14B and 14D, the lowerportion of gate stack 52 has a general tapered profile, with the entirelower portion being narrower than the upper portion. At level 58,however, gate stack 52 has a neck, and some portions of gate stack 52lower than level 58 have widths greater than the width at level 58. Theneck at level 58 is also shown in FIG. 13.

FIGS. 15A and 15B through FIGS. 21A, 21B, and 21C illustratecross-sectional views of intermediate stages in the formation of aFinFET in accordance with alternative embodiments. These embodiments aresimilar to the embodiments in FIGS. 1 through 12A/12B/12C, except thatthe first etching process of the dummy gate electrode layer stops afterdummy gate dielectrics 34 are exposed. Unless specified otherwise, thematerials and the formation methods of the components in theseembodiments are essentially the same as the like components, which aredenoted by like reference numerals in the embodiments shown in FIGS. 1through 12A, 12B, and 12C. The details regarding the formation processand the materials of the components shown in FIGS. 15A/15B through21A/21B/21C may thus be found in the discussion of the embodiment shownin FIGS. 1 through 12A/12B/12C.

The initial steps of these embodiments are essentially the same as shownin FIGS. 1 through 6A and 6B, and the resulting structure is illustratedin FIGS. 15A and 15B, which are similar to what are shown in FIGS. 6Aand 6B, respectively. Next, as shown in FIGS. 16A and 16B, upper dummygate electrode portion 36A is etched. The etching is stopped at a levellower than the top surfaces of dummy gate dielectrics 34, and may belower than the top surfaces of semiconductor fins 32. Accordingly, thetop surfaces and the sidewalls of dummy gate dielectrics 34 are exposed.In accordance with some embodiments of the present disclosure, theheight H4 of the un-etched lower portion 36B is smaller than about 20percent of total height H5 of dummy gate electrode layer 36 to allowenough room for the lower portion of the resulting gate stacks to taper.

The subsequent steps are essentially the same as shown in FIGS. 8A/8Bthrough 12A/12B/12C. For example, in FIGS. 17A and 17B, protection layer40 is formed as a conformal layer. In FIGS. 18A and 18B, the horizontalportions of protection layer 40 are removed by etching, so that theunderlying lower dummy gate electrode portion 36B is exposed. Lowerdummy gate electrode portion 36B is then etched until STI regions 30 areexposed. The etching process is essentially the same as discussedreferring to FIGS. 9A and 9B. Next, a trimming process is performed, asshown in FIGS. 19A and 19B, so that the lower gate electrode portion 36Bare tapered. FIGS. 20A, 20B, and 20C illustrate the perspective view andthe cross-sectional views after the formation of gate spacers 42,source/drain regions 44, CESL 46, and ILD 48. The structure shown inFIGS. 20A, 20B, and 20C are similar to what are shown in FIGS. 11A, 11Band 11C, except that the bottom ends of protection layer 40 are lowerthan the top surfaces of semiconductor fins 32. The resulting FinFET 57is also similar to what is shown in FIG. 15.

FIGS. 21A, 21B, and 21C illustrate the perspective view and thecross-sectional views after replacement gate stack 52 is formed. Thestructure shown in FIGS. 21A, 21B, and 21C are similar to what are shownin FIGS. 12A, 12B and 12C, except that the bottom ends of protectionlayer 40 are lower than the top surfaces (and top surface levels 50) ofsemiconductor fins 32.

FIGS. 22A, 22B, 22C, and 22B illustrate the schematically profiles ofthe sidewalls of gate stacks 52. FIGS. 22A and 22B reflect thecross-sectional views corresponding to FIG. 21C. FIGS. 22C and 22Dreflect the cross-sectional views corresponding to the left part of FIG.21B. In FIGS. 22A and 22C, the upper portion of gate stack 52 isstraight and vertical, and the lower portion of gate stack 52 isstraight and continuously tapers down. In FIGS. 22B and 22D, the lowerportion of gate stack 52 has a general tapered profile, with the entirelower portion being narrower than the upper portion. At level 58′,however, gate stack 52 has a neck, and some portions of gate stack 52lower than level 58′ have widths greater than the width at level 58′.

It is appreciated that although the discussed embodiments use FinFETs asexamples, the concept of the present disclosure is readily applicable toother transistors such as planar transistors. For example, thepatterning of the dummy gate electrode layers of the planar transistorsmay adopt the etching process as discussed above, and the lower portionof the resulting replacement gate stack may have a tapered profile.

The embodiments of the present disclosure have some advantageousfeatures. Since the lower portions of the gate stacks may be at the samelevel as source/drain regions, by forming gate stacks with the lowerportions tapered, the distance between the gate stacks and theneighboring source/drain regions of the FinFETs is increased.Accordingly, the leakage current that may occur between the gate stacksand the source/drain regions is reduced. Furthermore, the parasiticcapacitance between the gate stacks and the source/drain regions isreduced.

In accordance with some embodiments of the present disclosure, a methodincludes forming a dummy gate electrode layer over a semiconductorregion, forming a mask strip over the dummy gate electrode layer, andperforming a first etching process using the mask strip as a firstetching mask to pattern an upper portion of the dummy gate electrodelayer. A remaining portion of the upper portion of the dummy gateelectrode layer forms an upper part of a dummy gate electrode. Themethod further includes forming a protection layer on sidewalls of theupper part of the dummy gate electrode, and performing a second etchingprocess on a lower portion of the dummy gate electrode layer to form alower part of the dummy gate electrode, with the protection layer andthe mask strip in combination used as a second etching mask. The dummygate electrode and an underlying dummy gate dielectric are replaced witha replacement gate stack. In an embodiment, the lower portion of thedummy gate electrode layer is etched in a process comprising: etchingthe lower portion until an isolation region underlying the dummy gateelectrode layer is revealed; and trimming the lower part of the dummygate electrode to have a tapered profile. In an embodiment, sidewalls ofthe upper part of the dummy gate electrode are substantially straight,and sidewalls of the lower part of the dummy gate electrode are moreslanted than the upper part of the dummy gate electrode. In anembodiment, the semiconductor region comprises a semiconductor finprotruding higher than top surfaces of isolation regions on oppositesides of the semiconductor fin, and an interface of the upper part andthe lower part of the dummy gate electrode is higher than a top surfaceof the semiconductor fin. In an embodiment, the semiconductor regioncomprises a semiconductor fin protruding higher top surfaces ofisolation regions on opposite sides of the semiconductor fin, and aninterface of the upper part and the lower part of the dummy gateelectrode is lower than a top surface of the semiconductor fin. In anembodiment, after the replacing, the replacement gate stack is encircledby the protection layer. In an embodiment, the method further includesremoving the protection layer. In an embodiment, the method furtherincludes forming an inter-layer dielectric to embed the protection layerand the dummy gate electrode therein, wherein the replacing comprises:etching the dummy gate electrode to form a trench in the inter-layerdielectric; and removing the protection layer from the trench.

In accordance with some embodiments of the present disclosure, a methodincludes forming isolation regions extending into a semiconductorsubstrate; forming a semiconductor fin protruding higher than theisolation regions; forming a dummy gate dielectric on the semiconductorfin; forming a dummy gate electrode layer over the dummy gatedielectric; performing a first etching process on an upper portion ofthe dummy gate electrode layer, wherein the first etching process isstopped when a top surface of a lower portion of the dummy gateelectrode layer is at an intermediate level between a top surface and abottom surface of the dummy gate electrode layer; depositing aprotection layer; removing horizontal portions of the protection layer,with a vertical portion of the protection layer encircling a remainingupper portion of the dummy gate electrode layer; and performing a secondetching process to etch the lower portion of the dummy gate electrodelayer, with the protection layer protecting the remaining upper portionof the dummy gate electrode layer during the second etching process. Inan embodiment, the method further includes replacing the remaining upperportion and a remaining lower portion of the dummy gate electrode layerand the dummy gate dielectric with a replacement gate stack. In anembodiment, the protection layer has sidewalls contacting sidewalls ofthe replacement gate stack. In an embodiment, the method furtherincludes removing the protection layer. In an embodiment, when the firstetching process is stopped, the dummy gate dielectric is embedded in thelower portion of the dummy gate electrode layer. In an embodiment, whenthe first etching process is stopped, the dummy gate dielectric isexposed. In an embodiment, the method further includes forming a gatespacer, wherein the protection layer has a bottom surface higher than abottom surface of the gate spacer.

In accordance with some embodiments of the present disclosure, a deviceincludes a semiconductor fin; a gate stack on a top surface andsidewalls of the semiconductor fin; a gate spacer comprising portions onopposite sides of the gate stack; a protection layer between the gatespacer and the gate stack, wherein the protection layer has a bottomsurface higher than a bottom surface of the gate spacer; and a sourceregion and a drain region on opposite sides of the gate stack. In anembodiment, the bottom surface of the protection layer is higher than atop surface of the semiconductor fin. In an embodiment, the bottomsurface of the protection layer is lower than a top surface of thesemiconductor fin. In an embodiment, the protection layer is formed of amaterial different from a material of the gate spacer. In an embodiment,the protection layer comprises portions on opposite sides of the gatestack, and the gate spacer comprises portion on opposite sides of acombined region that comprises the gate stack and the protection layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method comprising: forming a dummy gate electrode layer over asemiconductor region; forming a mask strip over the dummy gate electrodelayer; performing a first etching process using the mask strip as afirst etching mask to pattern an upper portion of the dummy gateelectrode layer, with a remaining portion of the upper portion of thedummy gate electrode layer forming an upper part of a dummy gateelectrode; forming a protection layer on sidewalls of the upper part ofthe dummy gate electrode; performing a second etching process on a lowerportion of the dummy gate electrode layer to form a lower part of thedummy gate electrode, wherein the protection layer and the mask strip incombination are used as a second etching mask; and replacing the dummygate electrode and an underlying dummy gate dielectric with areplacement gate stack.
 2. The method of claim 1, wherein the lowerportion of the dummy gate electrode layer is etched in a processcomprising: etching the lower portion until an isolation regionunderlying the dummy gate electrode layer is revealed; and trimming thelower part of the dummy gate electrode to have a tapered profile.
 3. Themethod of claim 1, wherein sidewalls of the upper part of the dummy gateelectrode are substantially straight, and sidewalls of the lower part ofthe dummy gate electrode are more slanted than the upper part of thedummy gate electrode.
 4. The method of claim 1, wherein thesemiconductor region comprises a semiconductor fin protruding higherthan top surfaces of isolation regions on opposite sides of thesemiconductor fin, and an interface of the upper part and the lower partof the dummy gate electrode is higher than a top surface of thesemiconductor fin.
 5. The method of claim 1, wherein the semiconductorregion comprises a semiconductor fin protruding higher than top surfacesof isolation regions on opposite sides of the semiconductor fin, and aninterface of the upper part and the lower part of the dummy gateelectrode is lower than a top surface of the semiconductor fin.
 6. Themethod of claim 1, wherein after the replacing, the replacement gatestack is encircled by the protection layer.
 7. The method of claim 1further comprising removing the protection layer.
 8. The method of claim1 further comprising forming an inter-layer dielectric over theprotection layer and the dummy gate electrode therein, wherein thereplacing comprises: etching the dummy gate electrode to form a trenchin the inter-layer dielectric; and removing the protection layer fromthe trench.
 9. A method comprising: forming isolation regions extendinginto a semiconductor substrate; forming a semiconductor fin protrudinghigher than the isolation regions; forming a dummy gate dielectric onthe semiconductor fin; forming a dummy gate electrode layer over thedummy gate dielectric; performing a first etching process on an upperportion of the dummy gate electrode layer, wherein the first etchingprocess is stopped when a top surface of a lower portion of the dummygate electrode layer is at an intermediate level between a top surfaceand a bottom surface of the dummy gate electrode layer; depositing aprotection layer; removing horizontal portions of the protection layer,with a vertical portion of the protection layer encircling a remainingupper portion of the dummy gate electrode layer; and performing a secondetching process to etch the lower portion of the dummy gate electrodelayer, with the protection layer protecting the remaining upper portionof the dummy gate electrode layer during the second etching process. 10.The method of claim 9 further comprising replacing the remaining upperportion and a remaining lower portion of the dummy gate electrode layerand the dummy gate dielectric with a replacement gate stack.
 11. Themethod of claim 10, wherein the protection layer has sidewallscontacting sidewalls of the replacement gate stack.
 12. The method ofclaim 9 further comprising removing the protection layer.
 13. The methodof claim 9, wherein when the first etching process is stopped, the dummygate dielectric is embedded in the lower portion of the dummy gateelectrode layer.
 14. The method of claim 9, wherein when the firstetching process is stopped, the dummy gate dielectric is exposed. 15.The method of claim 9 further comprising forming a gate spacer, whereinthe protection layer has a bottom surface higher than a bottom surfaceof the gate spacer. 16.-20. (canceled)
 21. A method comprising: forminga polysilicon layer; performing a first etching process on thepolysilicon layer, with a remaining portion of the polysilicon layerforming a polysilicon strip as a result of the first etching process,wherein the first etching process comprises: etching an upper portion ofthe polysilicon layer; forming a protection layer on a top surface andsidewalls of a remaining portion of the upper portion of the polysiliconlayer; and after the protection layer is formed, etching a lower portionof the polysilicon layer; performing a second etching process on thepolysilicon strip to make sidewalls of the lower portion of thepolysilicon strip to be more tapered than before the second etchingprocess, wherein the upper portion of the polysilicon strip is protectedfrom the second etching process; and forming dielectric layers embeddingthe polysilicon strip therein.
 22. The method of claim 21, wherein thelower portion of the polysilicon strip has bottom portions beingincreasingly narrower than respective upper portions of the lowerportion of the polysilicon strip.
 23. (canceled)
 24. The method of claim21, wherein the protection layer is a conformal layer.
 25. The method ofclaim 21, wherein the polysilicon layer is formed on a semiconductorfin, and in the first etching process and the second etching process,the semiconductor fin is protected by an additional dielectric layer.26. The method of claim 21, wherein the etching the lower portion of thepolysilicon layer is performed with a first bias power, and the secondetching process is performed with a second bias power lower than thefirst bias power.